Global Die Attach Adhesives Market is Projected to Grow at a CAGR of over 5% During 2021-2027

Published | 10 November 2020

According to BlueWeave Consulting, the global die-attach adhesives market to grow at a CAGR of 5% during 2021-2027 (forecast period). The market is primarily supported by growth in the automotive sector and the consumer electronics segment. These die-attach adhesives have been used in a wide range of applications that ranges from industrial to commercial. Additionally, die-attach materials are mainly used for packaging in the industries. The rising rate of urbanization and end-user consumable income disposable income are further fueling the market growth. The benefits associated with these materials such as high purity, low stress fast curing, and high package crack resistance are making them more attractive in the adhesive market.


Benefits of die-attach adhesives driving the market growth


The expanding demand for individuals toward modified materials leads to high demand for die-attach adhesives in the market. Die attach adhesives offers significant benefits as it gets easily attach semiconductor chips to packaging substrates. These materials also help to mitigate stress and control warpage during the system operation. Die attach adhesives are now considered as the mainstream and attribute advanced reliability properties. Die attach adhesives also have high thermal conductivity and is known for non-corrosive formulation. Moreover, it can be able to provide fast tacking or rapid cure speed. Die attach adhesive properties such as good water absorption and peel strength to advance package crack confrontation making them a reliable product to use in the market.


Rising disposable incomes would create a huge demand for die-attach adhesives


Die to attach adhesives demand could also rise due to the growing disposable incomes of the end consumers across the globe. Hence, the Die adhesives market would be benefitted from the market. Besides, the manufacturers of the die adhesives products increased their production to meet the high demand of the market. The die-attach materials raise the technical requirements such as high purity, high package crack resistance which are making them an even more attractive segment in the adhesive market and thus increasing buying and demand of the adhesive materials would be expected. Die Attach Adhesive is the materials that are required to attach components in the market. 


Automotive segment occupies the largest share of the die attach adhesives market


The popularity of the die attaches adhesives is growing significantly due to the benefits associated with it. The automotive segment is likely to dominate in the market as die-attach adhesives offer a convenient method of attaching electronics, semiconductors, and silicon wafers to the electronic circuit. Additionally, the major properties which make adhesives more attractive in the automotive sector for this type of application include its excellent thermal management, and adhesive can transfer and dissipate heat. The automotive industry is highly demanded in this sector. The electronically insulative with a good dielectric strength of die adhesives are highly enabled to the prevention of transfer charge and reduces the chance of short circuits.


Global Die Attach Adhesives Market: Regional insights


The global die-attach adhesives market is segmented into five regions including North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. The developing regions have gained momentum due to rising manufacturing units for Die attach adhesives in the market. The Asia pacific die-attach adhesives market is significantly growing as the die attach adhesives have become easily affordable among the end consumers. China is known as one of the largest producers and exporters of Die attach adhesives worldwide. Furthermore, the Middle East and Africa, and Europe region are expected to be the fastest-growing market for die-attach adhesives in a forecast timeframe.


North America is expected to witness significant growth in the market during the forecast period


In recent years, North America's die-attach adhesives market has gained momentum mainly due to the growing automotive and commercial sectors. The growing automotive in developing countries such as China and India are expected to generate lucrative opportunities for the market. The major factor driving growth in the North America die attaches adhesives market is the surging income levels of middle-class families who are the key consumers of die-attach adhesives. However, the presence of other various alternative options of die-attach adhesives may hamper the growth of die-attach adhesives in the market.


The leading players” in the die attach adhesives market include Senju, Alpha Assembly Solutions, Shenmao Technology, Henkel, Shenzhen Weite New Material, Indium Corporation, Heraeus, Sumitomo Bakelite Co. Ltd., Tamura Corporation, AIM Solder, Asahi Solder, KYOCERA Corporation, Shanghai Jinji, NAMICS Corporation, Hitachi Chemical Co. Ltd., Nordson EFD, Dow Inc., Palomar Technologies, Creative Materials Inc, Hybond Inc, Master Bond Inc., AL Technology Inc, Dow Silicones Corporation, LG Chem, and others. Die attach adhesives Company and other prominent players are expanding their presence in the market by implementing various business strategies. 


Don’t miss the business opportunity of Die Attach Adhesives Market. Consult our analyst, gain crucial insights, and facilitate your business growth.


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