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Global Epoxy Molding Compound Market Bwc20120

Global Epoxy Molding Compound Market Bwc20120

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Global Epoxy Molding Compound Market, By Type (Normal Epoxy Molding Compound and Green Epoxy Molding Compound), By Application (Semiconductor Encapsulation and Electronic Components), By Industry Vertical (Electrical, Automotive, Aerospace and Others) and By Region (North America, Europe, Asia Pacific, Latin America and the Middle East & Africa); Trend Analysis, Market Competition Scenario & Outlook, 2016-2026

  • Published Date: August 2020
  • Report ID: BWC20120
  • Available Format: PDF
  • Page: 167

Report Overview

Global Epoxy Molding Compound Market has witnessed a constant growth in recent years and is anticipated to reach the revenues of USD 289.65 million by 2026 with a CAGR of 3.816%, over the prediction period 2019-2026.

Global Epoxy Molding Compound Market size- Industry Trends & Outlook Report 2026

 

Global Epoxy Molding Compound Market has witnessed a constant growth in recent years and is anticipated to reach the revenues of USD 289.65 million by 2026 with a CAGR of 3.816%, over the prediction period 2019-2026. The main factor driving the demand for epoxy molding compounds is the substitution of conventional materials with a material consisting of epoxy molding compounds.

 

The Epoxy Molding Compound (EMC) is intended to encapsulate different sensitive electronic devices. Starem EMC comprises a large variety of halogen-free compounds to fulfill the needs and specifications of different customers. Epoxies are considered useful as they are mechanically and environmentally shielded, and secure electrical or automotive goods. The factors mentioned tend to drive the growth of the global epoxy molding market. 

 

Global Epoxy Molding Compound- Market Overview

 

EMC (Epoxy Molding Compound) is an encapsulant used in most items where semiconductors are employed. The general home appliances like cell phones, refrigerators and televisions, industrial machinery and cars employ semiconductors. The global semiconductor market is growing with the growth of IT technology and the development of electronic goods based on new technologies, and demand for EMC is rising.

 

Epoxy molding compounds are primarily solid epoxy polymers which are heated to and converted into a liquid and then discharged into a shielded cable. Epoxy resins can react (cross-linked) either with catalytic homopolymerization or by a wide variety of co-reactants, including polyfunctional amines, acids (and acid anhydrides), phenols, alcohols, and thiols (usually referred to as mercaptans). Such co-reactants are also called hardeners or curatives, and the cross-linking reaction is usually referred to as curing.

 

Global Epoxy Molding Compound Market Outlook and Trends

 

Growth Driver 

 

Rising Need for Thermally Stable and Corrosion-resistant Components Drives the Epoxy Molding Compound Market

 

The main factor driving the demand for epoxy molding compounds is the substitution of conventional resin molding materials. Additionally, the properties such as heat-resistance, flame-resistance, high dielectric strength, and corrosion-resistance are other critical factors projected to fuel their adoption and demand assuring growth over the projected timeframe. Increasing demand for epoxy molding compounds across various end-use industries such as automotive and aerospace is expected to be a significant factor for these compounds in the coming years.

 

Impact of COVID-19 in industry

 

Due to global pandemic, social distancing norm is followed everywhere including healthcare, corporates and production houses. Most of them have allowed Work From Home to their employees, allotted tasks in multi shifts in premises and built separated working desks. The disruption is being experienced in regular business activities.

 

Significant volatility and decline in demand have been noticed as a result of reduced orders and order cancellations, leading to lower revenues, increased inventories, reduced value of inventories and lower gross margins.

 

The slowdown in economic activity and transportation restrictions in affected countries will likely have a bearing on the production and profitability of specific global companies, engaged in manufacturing or in supply of raw materials used in manufacturing. Small and medium-sized firms may have greater difficulty surviving the disruption. The manufacturing sector consisting of automotive, electrical devices, aerospace and others has been affected but intensity of effect defers from enterprise to enterprise. But, recovery is sure once the corona effect subsides.

 

Global Epoxy Molding Compound Market: By Industry Vertical

 

Epoxy molding compound finds its significant applications in the electrical, automotive, aerospace, and other industries. Over the projection period, the electrical segment is likely to emerge as the fastest-growing application market for epoxy molding compounds. The epoxy molding compounds manifest properties such as corrosion-resistance, thermal strength and heat resistance when exposed to elevated temperatures and harsh environmental conditions.

 

The automotive application market holds the second-largest market share, as the epoxy molding compounds prevent rust and corrosion on the body and critical metal parts of vehicles, thereby saving maintenance costs and increasing the average lifespan of automotive. They are deployed in mounts for electric motors, valve corners for automobiles and headlight liners.

Global Epoxy Molding Compound Market: Regional Insights

 

 

Based on regional segmentation global Epoxy Molding Compound market is segmented into, North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Among all regions, the North America region anticipated to witness the highest growth in the Epoxy Molding Compound market during the projection period. Asia-Pacific led by North America contributes substantial growth rate.

 

China has a major market share in both the global and Asia-Pacific market for epoxy molding compounds. The economic and industrial growth, availability of low-cost labor in the region, and rising demand for low-maintenance products are some of the factors driving the Asia-Pacific market for epoxy molding compounds.

 

Competitive landscape

 

The leading players in global Epoxy Molding Compound market are Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI, Eternal Materials, Jiangsu zhongpeng new material, Shin-Etsu Chemical, Hexion, Nepes, Tianjin Kaihua Insulating Material, HHCK, Scienchem, Beijing Sino-tech Electronic Material and Others.

 

Recent Developments

 

On 25, May 2020: Sumitomo Bakelite Co., Ltd. to begin production of Epoxy Resin Encapsulation Materials for automotive use in Europe- Sumitomo Bakelite will open a new manufacturing line to produce epoxy resin encapsulation materials for automotive use in its Belgian production subsidiary, in order to meet increasing demands in the mobility field in Europe.

 

 Scope of the Report

 

Attribute

Details

Years Considered

Historical data – 2016-2018

Base Year – 2019

Forecast – 2020 – 2026

Facts Covered

Revenue in USD Million

Market Coverage

U.S, Canada, Germany, UK, France, Italy, Spain, Brazil, Mexico, Japan, South Korea, China, India, UAE, South Africa, Saudi Arabia .

Product/Service Segmentation

By Type, By Application, By Industry Vertical

 

Key Players

Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI, Eternal Materials, Jiangsu zhongpeng new material, Shin-Etsu Chemical, Hexion, Nepes, Tianjin Kaihua Insulating Material, HHCK, Scienchem, Beijing Sino-tech Electronic Material and Others.

 

By Type

Ø  Normal Epoxy Molding Compound

Ø  Green Epoxy Molding Compound

 

By Application

 

Ø  Semiconductor Encapsulation

Ø  Electronic Components

 

By Industry Vertical

 

Ø  Electrical

Ø  Automotive

Ø  Aerospace

Ø  Others

 

By Region:


Ø  North America

Ø  Europe

Ø  Asia Pacific

Ø  Latin America

Ø  Middle East & Africa

 

The objective of the Study:

Ø  To analyze and estimate the Global Epoxy Molding Compound market size, in terms of value.

Ø  To examine the market segmentation carefully and estimate the market size, in terms of value, based on the region by segmenting the Global Epoxy Molding Compound market into five regions, namely, North America, Europe, Asia Pacific, Rest of the World and their leading countries.

Ø  To outline, categorize and project the Global Epoxy Molding Compound market based on the Type, Application and Industry Vertical and Region.

Ø  To examine competitive developments in applications, technology and diverse industry usage within the Global Epoxy Molding Compound Market.

Ø  To highlight market dynamics such as drivers, restraints, opportunities, and challenges and their impact.

Ø  To provide a detailed competitive landscape, including major players, their strategic profiles, and market shares.

 

Business Questions Answered by the Report

 

Ø  How will the market drivers, restraints, and opportunities affect the market dynamics?

Ø  What will be the market size in terms of value and volume and market statistics with a detailed classification?

Ø  Which segment dominates the market or region, and which one will be the fastest-growing, and why?

Ø  Who are the key players in the market, and what is their share?

Ø  What is the strategy adopted by key players, and how does it affect the existing and new players?

 

Customization Scope for the Client

 

Client satisfaction is our first and last priority, and that is why BlueWeave Consulting offers customization as per client’s specific needs. The following customization options are available for the report:

Ø  Additional Company Information

Ø  Detail Analysis of five additional companies

Ø  Additional country analysis

Ø  Detailed segment analysis

 

1.    Research Framework

1.1. Research Objective

1.2. Product Overview

1.3. Market Segmentation

2.    Research Methodology

2.1.     Qualitative Research

   2.1.1. Primary & Secondary Sources

2.2.     Quantitative Research

   2.2.1. Primary & Secondary Sources

2.3.   Market Breakdown & Data Triangulation

   2.3.1. Secondary Research

   2.3.2. Primary Research

2.4.    Regional Classification of Primary Research Respondents

2.5.    Assumptions & Limitations

3.    Executive Summary

4.    Global Epoxy Molding Compound Insights

4.1. Industry Value Chain Analysis

4.2. DROC Analysis

4.2.1.   Growth Drivers

4.2.2.   Restraints

4.2.3.   Opportunities

4.2.4.   Challenges

4.3. Market Key Trends

4.4. Global Epoxy Molding Compound Leading Company Analysis, 2019

4.5. Porter’s Five Forces Analysis

4.6. Impact of Covid-19 Across Industry

5.    Global Epoxy Molding Compound Market Overview

5.1. Market Estimates & Forecast by Value, 2016-2026

5.1.1.   By Value (USD Million)

5.2. Market Share & Forecast

5.2.1.  By Type

5.2.1.1.       Normal Epoxy Molding Compound

5.2.1.2.       Green Epoxy Molding Compound

5.2.2.  By Application

5.2.2.1.       Semiconductor Encapsulation

5.2.2.2.       Electronic Components

5.2.3.  By Industry Vertical

5.2.3.1.       Electrical

5.2.3.2.       Automotive

5.2.3.3.       Aerospace

5.2.3.4.       Others

5.2.4.  By Region

5.2.4.1.       North America

5.2.4.2.       Europe

5.2.4.3.       Asia Pacific

5.2.4.4.       Latin America

5.2.4.5.       Middle East & Africa

6.    North America Epoxy Molding Compound Market

6.1. Market Estimates & Forecast by Value, 2016-2026

6.1.1.   By Value (USD Million)

6.2. Market Share & Forecast

6.2.1.   By Type

6.2.2.   By Application

6.2.3.   By Industry Vertical

6.2.4.   By Country

6.2.4.1.       United States

6.2.4.2.       Canada

7.    Europe Epoxy Molding Compound Market

7.1. Market Estimates & Forecast by Value, 2016-2026

7.1.1.   By Value (USD Million)

7.2. Market Share & Forecast

7.2.1.   By Type

7.2.2.   By Application

7.2.3.   By Industry Vertical

7.2.4.   By Country

7.2.4.1.       Germany

7.2.4.2.       United Kingdom

7.2.4.3.       France

7.2.4.4.       Italy

7.2.4.5.       Spain

7.2.4.6.       Rest of Europe

8.    Asia Pacific Epoxy Molding Compound Market

8.1. Market Estimates & Forecast by Value, 2016-2026

8.1.1.   By Value (USD Million)

8.2. Market Share & Forecast

8.2.1.   By Type

8.2.2.   By Application

8.2.3.   By Industry Vertical

8.2.4.   By Country

8.2.4.1.       China

8.2.4.2.       India

8.2.4.3.       Japan

8.2.4.4.       South Korea

8.2.4.5.       Rest of APAC

9.    Latin America Epoxy Molding Compound Market

9.1. Market Estimates & Forecast by Value, 2016-2026

9.1.1.   By Value (USD Million)

9.2. Market Share & Forecast

9.2.1.   By Type

9.2.2.   By Application

9.2.3.   By Industry Vertical

9.2.4.   By Country

9.2.4.1.       Brazil

9.2.4.2.       Mexico

9.2.4.3.       Rest of Latin America

10.Middle East & Africa Epoxy Molding Compound Market

10.1.             Market Estimates & Forecast by Value, 2016-2026

10.1.1.                By Value (USD Million)

10.2.             Market Share & Forecast

10.2.1.                By Type

10.2.2.                By Application

10.2.3.                By Industry Vertical

10.2.4.                By Country

10.2.4.1.    UAE

10.2.4.2.    Saudi Arabia

10.2.4.3.    South Africa

10.2.4.4.    Rest of MEA

11.Company Profile (Company Overview, Financial Matrix, Product landscape, Key Personnel, Key Competitors, Contact Address, and Strategic Outlook)*

11.1.   Sumitomo Bakelite

11.2.   Hitachi Chemical

11.3.   Chang Chun Group

11.4.   Hysol Huawei Electronics

11.5.   Panasonic

11.6.   Kyocera

11.7.   KCC

11.8.   Samsung SDI

11.9.   Eternal Materials

11.10.          Jiangsu zhongpeng new material

11.11.          Shin-Etsu Chemical

11.12.          Hexion

11.13.          Nepes

11.14.          Tianjin Kaihua Insulating Material

11.15.          HHCK

11.16.          Scienchem

11.17.          Beijing Sino-tech Electronic Material

11.18.          Other Prominent Players

 

*Financial details in case of unlisted companies will be provided as per data availability.

**The segmentation and the companies are subjected to modifications based on the in-depth secondary for the final deliverable

 

Market Segmentation

By Type

Ø Normal Epoxy Molding Compound

Ø Green Epoxy Molding Compound

 

 

By Application

 

 

Ø Semiconductor Encapsulation

Ø Electronic Components

 

 

By Industry Vertical

 

 

Ø Electrical

Ø Automotive

Ø Aerospace

Ø Others

 

 

By Region:

 

Ø North America

Ø Europe

Ø Asia Pacific

Ø Latin America

Ø Middle East & Africa

 

 

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