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Japan LED Packaging Market, By Package Type (SMD (Surface Mount Device Package), COB (Chip On Board Package), CSP (Chip Scale Package), and Others); By Power Range (Low- & Mid-Power Led Packages, and High-Power Led Packages); By Wavelength (Visible & Infrared, and Deep UV); By Packaging Material (Plastic , Nanoceramics, Ceramics, Silicone Materials, Epoxy Molding Compound, Metal Alloys, Polymers, Glass Composites, and Others); By Application (Automotive, Residential, Television, Industrial, and Others) Trend Analysis, Competitive Market Share & Forecast, 2017-2027